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Touch thin and light to promote touch and drive IC integration
Source: Sanfang Xinli Microelectronics Release time: 2016-10-31
International touch IC manufacturer Synaptics announced the acquisition of panel driver IC supplier Renesas SPDrivers for USD 470 million. This is another case of large-scale marriage between the touch IC factory and driver IC factory in the industry after the previous Duntai acquisition of Asahi. TrendForce, a global market research organization, said that similar mergers and acquisitions will open a new page for the integration of TDDI (TouchwithDisplayDriver).
The TDDI concept has been proposed for some time. Under this structure, in addition to reducing costs by reducing the use of ICs, it also helps to simplify circuit design and shorten development time; for customers, because the supply chain For the sake of integration, the management efficiency of the procurement system can be improved. However, due to the fact that the business resources of touch ICs and panel driver ICs are in the hands of manufacturers of different ethnic groups, coupled with the fact that panel manufacturers have a high degree of mastery of driver IC development and subsequent order resources, the promotion of TDDI has always faced considerable obstacles.
TrendForce pointed out that there are three most favorable directions for the current development of TDDI. First of all, the panel glass, touch module and other related IC component resources of white-brand mobile phones are mostly integrated by small and medium-sized panel module vendors in southern China. Under such a self-contained supply chain architecture, these module vendors It has the conditions and ability to promote the public version of the framework products, and the effective CostDown ability of TDDI helps to optimize the quotation problem that white card mobile phone manufacturers attach great importance to, and it is easy to evoke the resonance of module vendors.
The second is for products with less frequent design changes. Taking the Apple iPhone smart phone as an example, in recent years, new products have been steadily launched at an annual frequency. The longer the product life cycle, the larger the cumulative shipments, which will help Reduce the amortization of development costs per unit, so that the cost advantage of TDDI can be more leveraged. Unfortunately, in addition to the Android-based smart phone products on the market, due to the shortening of generations, the panel and touch module revision speed has become more frequent. Under this premise, TDDI is compared with traditional touch Compared with the independent and separate architecture of the driver IC, the advantages that can be demonstrated become relatively limited.
Finally, the focus is on panel integrated touch products that are actively promoted by panel manufacturers recently. At this stage, Taiwan ’s panel manufacturers Innolux, AUO, and CPT all focus on the development of On-cell architecture, while Korean LGD and Japanese JDI are betting on On the more complex In-cell architecture. For panel makers, both In-cell and On-cell are important weapons for grabbing the touch performance pie, and the integration of touch and drive IC is an inevitable trend for long-term development. This type of product does not provide the best development environment for TDDI at this stage, and has the opportunity to become the first block for the popularization of TDDI.
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