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Mainland IC design will surpass Taiwan in the next two years
Source: Sanfang Xinli Microelectronics Release time: 2016-10-31
According to the estimates of the well-known American consulting firm Mckinsey, with official support from China, its semiconductor industry can obtain capital support of up to 150 billion US dollars from China's National Integrated Circuit Industry Investment Fund, local governments, state-owned enterprises and banks. In addition, according to statistics from research institutes such as MIC and IE, in just a few years, the scale of the IC design industry in mainland China has approached Taiwan; the packaging and testing industry has overtaken the United States and Japan; the mainland will also build a new 12-inch factory in the next few years. Region with the most mass production.
According to the Industrial and Economic Research Center (IEK) statistics of the Industrial Research Institute, under the active support of local IC design companies in the mainland, the global market share of the mainland's IC design industry has rapidly approached Taiwan; last year, the output value of the IC design industry in Taiwan was approximately 57.63 billion yuan. China About 519.3 billion yuan, only 10% less than Taiwan, and it is possible to surpass Taiwan in the past two years.
According to a survey conducted by IC Insights, a media survey agency, although MediaTek ranked the world ’s third-largest IC design company last year, Hisilicon, a subsidiary of Huawei Group, has leapt to the sixth position in the world. Also squeezed into the tenth largest in the world.
According to statistics from research agency Gartner, last year, among the top ten global packaging and testing industries, mainland players have squeezed into two. After the acquisition of Singapore Xingke Jinpeng by Jiangsu Changdian, Jiangsu Changdian increased its revenue by 70% and market share last year. It increased greatly by 83%, leapt from sixth to fourth, and gradually approached the third-ranked Taiwanese silicon product.
According to statistics from the Institute of Industrial Intelligence (MIC) of the Institute of Assets and Information Technology, the market share of mainland China in the global packaging and testing industry has changed from the "old five" position three years ago. Last year, it has overtaken the United States, Japan, and the United States, ranking the second largest, second only In Taiwan.
In addition, at least eight 12-inch wafer fabs worldwide will join the operation next year, most of which are located on the mainland. It is obvious that in the next few years, the mainland will be the region with the largest number of 12-inch fabs in the world.
At present, three wafer foundries in Taiwan have successively invested in the mainland to build 12-inch wafer fabs, including TSMC's wholly-owned plant in Nanjing, and UMC's joint venture with the Xiamen Municipal Government, Powerchip and the Hefei Municipal Government. (Global Foundries) also has a joint venture with Chongqing Municipal Government to build a 12-inch wafer fab.
According to Chinese media reports, China ’s National Manufacturing Power Construction Strategy Advisory Committee has called out at the end of the “Thirteenth Five-Year Plan” (ie 2016 to 2020). Mainland-made IC products and technologies must meet 50% of domestic demand. Demand, according to the current IC self-sufficiency rate in mainland China is only 20%, which is equivalent to double. Five times.
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